基于298/77 K循环处理回收PCB中非金属组分

李蓬勃; 张林楠; 张啸; 李宣延; 李赫; 高彤

doi:10.12153/j.issn.1674-991X.20230156

基于298/77 K循环处理回收PCB中非金属组分

doi: 10.12153/j.issn.1674-991X.20230156

沈阳工业大学环境与化学工程学院

基金项目: 沈阳工业大学青年培育基金（070/200005778）

详细信息

作者简介:
李蓬勃（1995—），男，硕士研究生，主要从事废印制电路板处理研究，826512508@qq.com

通讯作者:
张林楠（1973—），男，教授，博士，主要从事固体废物处理研究，707460916@qq.com

张啸（1986—），男，讲师，博士，主要从事冶金资源综合利用研究，754862983@qq.com

中图分类号: X705
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- PDF下载量: 22
- 被引次数: 0
出版历程
- 收稿日期: 2023-02-27
- 录用日期: 2023-05-24
- 修回日期: 2023-04-07
- 网络出版日期: 2023-08-01

Recycling of non-metallic components in PCB based on 298/77 K cycle treatment

School of Environmental and Chemical Engineering, Shenyang University of Technology

摘要

摘要:
为解决废印制电路板（PCB）中非金属组分回收难且二次污染率大的问题，引入298/77 K循环处理技术，首先分析温度改变对PCB内部结构所造成的影响及PCB内部力学性能的变化，测试静电分选和离心分选对PCB非金属组分回收率的实际影响，之后引入CaF₂作为精炼过程中的强氧化剂，测试PCB内部结构发生改变后的硅组分回收率，最后测定回收后硅元素的实际纯度。结果表明：PCB在经过298/77 K循环处理后，内部结构受温度循环影响发生明显变化；各项力学性能均实现明显下降；PCB非金属组分实际产出量和硅组分回收率，相比于传统处理方式实现了明显提升，且对原PCB中各项杂质有较好的去除效果，硅元素占比在97%以上。
- 废印制电路板 /
- 内部结构 /
- 非金属组分 /
- 循环处理 /
- 回收率 /
- 硅元素
Abstract:
In order to solve the problems of difficult recovery of non-metallic components and high secondary pollution rate in waste printed circuit board (PCB), 298/77 K cycling treatment technology was introduced. First, the effect of temperature change on the internal structure of PCB and the change of mechanical properties in PCB were analyzed, and the actual effect of static and centrifugal separation on the recovery rate of non-metallic components in PCB was tested. Then, CaF₂ was introduced as strong oxidant in the refining process. The recovery of silicon components after the change of internal structure of PCB was tested and the actual purity of silicon elements after recovery was determined. The results showed that after 298/77 K cycle treatment, the internal structure of PCB changed significantly under the influence of temperature cycle. The mechanical properties were significantly reduced. The actual output of PCB non-metallic components and the recovery of silicon components had been significantly improved compared with the traditional treatment, and the impurities in the original PCB had been well removed. The mass fraction of silicon element accounted for more than 97%.
- waste printed circuit board /
- internal structure /
- non-metallic components /
- cyclic processing /
- rate of recovery /
- silicon element

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图 1 不同浸泡时间的PCB微观形貌

Figure 1. Micromorphology of PCB under different soaking times

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图 2 PCB在不同模式下的内部结构微观形貌

Figure 2. Micromorphology of internal structure of PCB under different modes

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图 3 PCB受冷冻抑制机理

Figure 3. Mechanism of PCB inhibition by freezing

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图 4 PCB热膨胀系数对比

Figure 4. Comparison of PCB coefficients of thermal expansion

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图 5 PCB力学性能表征

Figure 5. Mechanical properties of PCB

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图 6 硅组分强化精炼流程

Figure 6. Silicon component enhanced refining process

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表 1 主要试验仪器名称

Table 1. Name of main experimental instruments

试验仪器	型号	生产厂家
破碎机	SS-1022	武义海纳电器有限公司
高能球磨机	SPEX Sample Prep 8000M	青岛佳鼎分析仪器有限公司
高压电选机	XDF250×200	石城县国邦矿山机械有限公司
离心机	MC-15K	上海精胜科学仪器有限公司
环境试验箱	FT-DW系列	苏州菲唐检测设备有限公司
电子万能试验机	E44型	美国MTS公司
扫描电镜	Apreo 2C	赛默飞世尔科技（中国）有限公司
简支梁冲击试验机	JBW-750H	济南普业机电技术有限公司
光谱仪	ARL3460	赛默飞世尔科技（中国）有限公司

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表 2 PCB的实际产出量

Table 2. Actual output of PCB

项目	粒径/mm	实际产出量/g
项目	粒径/mm	静电分选	离心分选
	>0.147	2.006 2	2.229 5
非金属	0.074~0.147	2.070 5	2.282 4
	<0.074	2.101 9	2.312 0
	>0.147	2.323 3	2.455 1
金属	0.074~0.147	2.358 6	2.545 2
	<0.074	2.401 8	2.577 0

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